Good Quality HDI PCB with Cheaper Price made in Shenzhen China
What is HDI PCB?
HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb. An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. Hitech Circuits Co., Limited is a professional high-density interconnect pcbs, hdi pcb board manufacturer, supplier and design company from China, if you are looking for reliable high density interconnect PCb board partner from China, please don’t hesitate to contact [email protected].
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). There are different types of HDI features, type I, type II and type III as defined in IPC-2226.
High density interconnect (HDI) printed circuit design and fabrication started in 1980 when researchers started investigating ways to reduce the size of vias in PCBs. The first production build-up or sequential printed boards appeared in 1984. Ever since that time, designers and component manufacturers always look for ways to pack more functions on a single chip and a single board. Today, HDI board design and fabrication are codified in the IPC-2315, IPC-2226, IPC-4104, and IPC-6016 standards.
High-Density Interconnect (HDI) in PCB manufacturing refers to the use of advanced technology to create intricate circuit boards with densely packed components. This technology is of significant importance in electronic products, especially in today’s era of miniaturization and increased functionality.
The applications and advantages of HDI technology in PCB manufacturing are vast. It allows for the creation of smaller, lighter, and more efficient electronic devices by enabling the integration of complex circuits in a limited space. Furthermore, HDI technology enhances the electrical performance of these devices, leading to improved signal integrity and overall functionality.
In the manufacturing process of HDI technology in PCB, several intricate steps are involved to achieve the desired high-density interconnects. These processes are crucial for creating circuit boards with densely packed components and ensuring their optimal functionality.
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